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16 Publications


2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
LibreCat | Files available | Download (ext.)
 

2023 | Conference Paper | LibreCat-ID: 44036
Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP)
T. Borgert, W. Homberg, in: Materials Research Proceedings, Materials Research Forum LLC, 2023.
LibreCat | DOI
 

2021 | Journal Article | LibreCat-ID: 22272
Influence of the Rivet Coating on the Friction during Self-Piercing Riveting
B. Uhe, C.-M. Kuball, M. Merklein, G. Meschut, Key Engineering Materials 883 (2021) 11–18.
LibreCat | DOI
 

2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat | DOI
 

2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat | DOI
 

2015 | Conference Paper | LibreCat-ID: 9952
A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties
F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.
LibreCat
 

2015 | Journal Article | LibreCat-ID: 34441
Investigation of wear resistance of dry and cryogenic turned metastable austenitic steel shafts and dry turned and ground carburized steel shafts in the radial shaft seal ring system
D. Frölich, B. Magyar, B. Sauer, P. Mayer, B. Kirsch, J.C. Aurich, R. Skorupski, M. Smaga, T. Beck, D. Eifler, Wear 328–329 (2015) 123–131.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat | DOI
 

2014 | Journal Article | LibreCat-ID: 9876
High-velocity operation of piezoelectric inertia motors: experimental validation
M. Hunstig, T. Hemsel, W. Sextro, Archive of Applied Mechanics (2014) 1–9.
LibreCat | DOI
 

2014 | Journal Article | LibreCat-ID: 34442
A comprehensive model of wear, friction and contact temperature in radial shaft seals
D. Frölich, B. Magyar, B. Sauer, Wear 311 (2014) 71–80.
LibreCat | DOI
 

2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
LibreCat | DOI
 

2013 | Journal Article | LibreCat-ID: 9803
Modelling the friction contact in an inertia motor
M. Hunstig, T. Hemsel, W. Sextro, Journal of Intelligent Material Systems and Structures 24 (2013) 1380–1391.
LibreCat | DOI
 

2012 | Conference Paper | LibreCat-ID: 9784
An efficient simulation technique for high-frequency piezoelectric inertia motors
M. Hunstig, T. Hemsel, W. Sextro, in: Ultrasonics Symposium (IUS), 2012 IEEE International, 2012, pp. 277–280.
LibreCat | DOI
 

2011 | Journal Article | LibreCat-ID: 9772
Friction in wheel--rail contact: A model comprising interfacial fluids, surface roughness and temperature
C. Tomberger, P. Dietmaier, W. Sextro, K. Six, Wear 271 (2011) 2–12.
LibreCat | DOI
 

2004 | Conference Paper | LibreCat-ID: 8952
Systematic mistuning of bladed disk assemblies with friction contacts
F. Götting, W. Sextro, L. Panning, K. Popp, in: Proceedings of ASME TURBO Expo, Power for Land, Sea, and Air, 2004, pp. 257–267.
LibreCat
 

2000 | Conference Paper | LibreCat-ID: 8915
State of the art and development trends of ultrasonic linear motors
T. Hemsel, J. Wallaschek, in: Ultrasonics Symposium, 2000 IEEE, 2000, pp. 663–666 vol.1.
LibreCat | DOI
 

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